MCP1790/MCP1791
1.0
ELECTRICAL
CHARACTERISTICS
? Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
Absolute Maximum Ratings ?
Input Voltage, V IN ........................................................+48.0V
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
V IN , PWRGD, SHDN ..................... (GND-0.3V) to ( V IN +0.3V)
V OUT .................................................... (GND-0.3V) to (+5.5V)
Internal Power Dissipation ............ Internally-Limited (Note 4)
Output Short Circuit Current..................................Continuous
Storage temperature .....................................-55°C to +150°C
Maximum Junction Temperature .....................165°C (Note 7)
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins ........ ≥ 6 kV HBM and ≥ 400V MM
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, V IN = V OUT(MAX) + V DROPOUT(MAX), (Note 1) , I OUT = 1 mA,
C OUT = 4.7 μF (X7R Ceramic), C IN = 4.7 μF (X7R Ceramic), T A = +25°C, SHDN > 2.4V.
Boldface type applies for junction temperatures, T J (Note 5) of -40°C to +125°C.
Parameters
Input Operating Voltage
Input Quiescent Current
Input Quiescent Current for SHDN
Mode
Ground Current
Maximum Output Current
Line Regulation
Load Regulation
Output Peak Short Circuit Current
Output Voltage Regulation
V OUT Temperature Coefficient
Input Voltage to Turn On Output
Symbol
V IN
I q
I SHDN
I GND
I OUT
Δ V OUT /
(V OUT X Δ V IN )
Δ V OUT /V OUT
I OUT_SC
V OUT
TCV OUT
V ON
Min
6.0
70
-0.45
V R -2.5%
Typ
70
10
110
±0.0002
±0.2
V R /10
V R
65
5.5
Max
30.0
130
25
210
±0.05
0.45
V R +2.5%
6.0
Units
V
μA
μA
μA
mA
%/V
%
A
V
ppm/°C
V
Conditions
+48 V DC Load Dump Peak
< 500 ms
I L = 0 mA
SHDN = GND
I L = 70 mA
6.0V < V IN < 30V
I OUT = 1 mA to 70 mA
R LOAD < 0.1 Ω ,
Peak Current
Rising V IN
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
The minimum V IN , V IN(MIN) must meet two conditions: V IN ≥ 6.0 V and V IN ≥ V OUT(MAX) + V DROPOUT(MAX).
V R is the nominal regulator output voltage.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained
junction temperatures above 165°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V IN = V R + V DROPOUT( MAX ) .
Sustained junction temperatures above 165°C can impact the device reliability.
The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the
short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then
the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10^6/(V R * Δ Temperature), V OUT-HIGH = highest voltage measured over the temperature
range. V OUT-LOW = lowest voltage measured over the temperature range.
DS22075B-page 4
? 2010 Microchip Technology Inc.
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